WATER SOLUBLE FLUX
1.适合FC和BGA类产品 Multi package use:Flip Chip/BGA
2.多种涂敷方式 Multi coating method:screen printing/pin transfer
3.优异的水洗性 Excellent water solubility
4.优异的OSP清洗能力 Good capability for OSP Wipe off
1.适合FC和BGA类产品 Multi package use:Flip Chip/BGA
2.多种涂敷方式 Multi coating method:screen printing/pin transfer
3.优异的水洗性 Excellent water solubility
4.优异的OSP清洗能力 Good capability for OSP Wipe off